Vaizdas | PAGRINDINĖ dalis # Gamintojas | Aprašymas / PDF | Kiekis / RFQ |
---|---|---|---|
Parker Chomerics |
CHO-THERM T441 TO-3 0.008. |
106274vnt. sandėlyje |
|
t-Global Technology |
THERM PAD 28MMX28MM RED. |
46760vnt. sandėlyje |
|
t-Global Technology |
THERM PAD 100MMX100MM W/ADH YLW. |
19647vnt. sandėlyje |
|
Wakefield-Vette |
THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole |
190859vnt. sandėlyje |
|
t-Global Technology |
THERM PAD 19.5MMX12.7MM YELLOW. |
623475vnt. sandėlyje |
|
Parker Chomerics |
CHO-THERM T441 TO-3 0.008 ADH. |
103911vnt. sandėlyje |
|
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX304.8MM GRAY. Thermal Interface Products Tgon 810 A0 12x18" sheet |
9398vnt. sandėlyje |
|
t-Global Technology |
THERM PAD 25MMX25MM RED. |
37557vnt. sandėlyje |
|
Wakefield-Vette |
THERM PAD 1.003 X 1.003. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.003 Inch x 1.003 Inch, No Hole |
133600vnt. sandėlyje |
|
Apex Microtechnology |
THERM PAD 18.03MMX12.7MM 10/PK. |
3629vnt. sandėlyje |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM BLUE. |
661vnt. sandėlyje |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5170 9x9" 2.8W/mK gap filler |
668vnt. sandėlyje |
|
t-Global Technology |
THERM PAD 1.1MX27MM W/ADH WHITE. |
24040vnt. sandėlyje |
|
t-Global Technology |
THERM PAD 19.05MMX12.7MM WHITE. |
283397vnt. sandėlyje |
|
Parker Chomerics |
CHO-THERM 1671 DO-4. |
33884vnt. sandėlyje |
|
Parker Chomerics |
CHO-THERM T441 DO-4 0.008. |
275062vnt. sandėlyje |
|
Parker Chomerics |
CHO-THERM 1671 TO-220 W/ADH. |
43906vnt. sandėlyje |
|
Parker Chomerics |
CHO-THERM 16740.010. |
222668vnt. sandėlyje |
|
Parker Chomerics |
CHO-THERM T500 TO-3 0.010 ADH. |
19442vnt. sandėlyje |
|
t-Global Technology |
THERM PAD 19.05MMX10.41MM RED. |
301681vnt. sandėlyje |