Aavid Gamintojas, Sandėlyje Aavid Produktai

PAGRINDINĖ dalis # Gamintojas	Aprašymas / PDF	Kiekis / RFQ
321127B00000 Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK.	21758vnt. sandėlyje
2286BG Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Extruded Heatsink, Radial Fin, Square, 0.79x0.155 Inch	11128vnt. sandėlyje
6084BG Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, 8.38x13.21x19.05mm	81884vnt. sandėlyje
6263B-MT5G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks High-Rise Style Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, Black Anodized, 10.16x44.45x44.7mm	44944vnt. sandėlyje
2207/PR11B ASSY Aavid, Thermal Division of Boyd Corporation	HEAT SINK.	3163vnt. sandėlyje
7025BG Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Channel Style Heatsink for TO-220, Folded Back Fins, Vertical Mounting, 6.8 n Thermal Resistance, No Solderable tabs, 2.90mm Hole	141875vnt. sandėlyje
6273BG Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Board Level Stamped Heatsink for TO-202, Vertical Mounting, 9.52x19.05x19.05mm	71827vnt. sandėlyje
2283B Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK.	6911vnt. sandėlyje
341600F00000G Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm	36131vnt. sandėlyje
6381BG Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks High Power Extruded Style Heatsink for MULTIWATT, Vertical Mounting, 5.8 n Thermal Resistance, Black Anodized, 2.89mm Hole, 38.1mm, Solderable Pins	38264vnt. sandėlyje
326005R00000G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Heatsink for TO-5, Vertical Mounting, 12.7x12.7x9.52mm	54891vnt. sandėlyje
2207/PR11B ASSYG Aavid, Thermal Division of Boyd Corporation	HEATSINK.	2070vnt. sandėlyje
335714B00000G Aavid, Thermal Division of Boyd Corporation	HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 30x30x7mm, IC Pkg Size = 30 x 30, Epoxy	103241vnt. sandėlyje
322805B00000G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Vertical Mounting, 22.23x22.23x13.49mm	39987vnt. sandėlyje
342000F00000G Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm	23471vnt. sandėlyje
115600F00000G Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Rail Mounting Heatsink Clip, Stainless Steel	473765vnt. sandėlyje
1130BG Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Thermal Link with BeO Insulator for TO-5, Vertical Mounting, Black Anodized, 15 n Thermal Resistance	9207vnt. sandėlyje
325705R00000G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Cylindrical, Press Fit, Aluminum, Red Anodized, 12.70mm OD, 6.35mm Height	54530vnt. sandėlyje
6000DG Aavid, Thermal Division of Boyd Corporation	HEAT SINK. Heat Sinks Stamped Heatsink for Axial Lead Devices, Vertical Mounting, Copper, 15 n Thermal Resistance, Tin Plated	46895vnt. sandėlyje
335214B00000G Aavid, Thermal Division of Boyd Corporation	HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 25x25x10mm, IC Pkg Size = 25 x 25, Epoxy	73229vnt. sandėlyje

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